As AI wearable devices like smart glasses and smartwatches continue to evolve the storage that powers their most capable functions grows increasingly important. Multimodal AI capabilities, more compact designs, and longer-battery life expectations demand smaller form factors, lower power consumption, and higher performance storage solutions. With its ultra-compact footprint, high performance and strong reliability, BIWIN ePoP5x delivers a compact yet powerful storage solution for smart wearables, enabling slim devices to unleash their powerful AI capabilities.
BIWIN has a strong pedigree for building compact storage solutions for smart devices. Leveraging ultra-thin multi-layer stacked packaging technology together with strong hardware and firmware R&D capabilities, BIWIN offers high performance, high reliability, and strong power-efficiency in a range of embedded storage solutions
The BIWIN ePoP series has been deployed at scale in flagship wearable devices of several leading global brands. BIWIN ePoP5x further pushes the boundaries of performance and form factor, delivering at least 25% lower power consumption, 2x faster data transfer speeds, and as much as 32% thinner packaging, meeting the storage and performance requirements of modern mobile devices.
Key Advantages of BIWIN ePoP5x
- Compliant with JEDEC standards, Biwin ePoP5x integrates eMMC and LPDDR5X in the package with a ball pitch of 0.35 mm and ultra-compact dimensions of 0 × 9.5 × 0.54 mm. Designers can mount the package directly on the main SoC, enabling ultra-thin system designs for AI wearables such as smart glasses and smartwatches.
- The LPDDR5X core uses an ultra-low-voltage architecture, delivering idle power consumption as low as 100μA. The I/O voltage can be reduced to 0.3V (with ODT disabled). Even under high workloads, the design effectively manages power and thermal conditions, helping prevent system instability and significantly extending battery life per charge for mobile devices.
- BIWIN ePoP5x integrates error detection and bad block management mechanisms, and supports RPMB secure storage, as well as FFU hardware updates. It also supports a wide operating temperature range of -25°C to +85°C, ensuring data security and long-term system stability.
- The eMMC supports HS400 high-speed mode, delivering data transfer rates up to 400 MB/s, while LPDDR5X provides data rates up to 8533 Mb/s. Combined with a 16n/32n prefetch architecture, BIWIN ePoP5x enables fast content loading and efficient processing of high-frequency workloads.
BIWIN’s ePoP solution, based on a 201-ball LPDDR5X package, delivers ultra-compact size, low power consumption, high performance, and strong reliability, making it suited for high-end smart wearables and mobile devices, and delivering a superior user experience through advanced storage technology.
Ultra-Compact Size
- The minimal internal footprint supports the design of lightweight AI smart glasses and high-end smartwatches, as well as freeing up valuable board space for integrated layouts in ultra-thin smartphones and other mobile devices.
Low Power Consumption
- Lightweight power demands extend device battery life and reduce heat generation in wearable devices, enhancing user comfort during prolonged use. Lower power consumption under high workloads helps alleviate battery drain in demanding mobile usage scenarios.
High Performance
- Fast read and write speeds supports high-load workloads in AI smartglasses, enables second-level boot-up for high-end smartwatches, and meets the demands of multitasking and high-definition imaging in smartphones, ensuring an immersive experience for AI-powered devices.
Strong Reliability
- Realiable build quality ensures stable operation of smart wearable devices, while enhancing the durability of mobile devices against drops and long-term wear. The design also helps withstand complex environment conditions, safeguarding data security.
Biwin ePoP5x Unlocks a Next Generation of Smart Devices
Through its combined solution development and advanced packaging and manufacturing, BIWIN continuously optimizes and upgrades product performance and form factor, while rapidly responding to customer customization requirements. This model enables close coordination across the entire product lifecycle – from technology pre-development and engineering validation to mass production and delivery. BIWIN ePoP5x not only demonstrates BIWIN’s technological advancement and innovation in the smart wearable sectors, but also delivers a ‘compact size + high performance’ storage solution for mobile devices.
As AI wearables continue to evolve toward lighter form factors and more intelligent interaction experience, BIWIN will remain focused on the needs of device manufacturers and end-user experience, further advancing its expertise in miniaturized embedded storage. By accumulating more core technologies and high-value patents, BIWIN aims to build a portfolio of high performance, low-power, and highly reliable embedded storage for the edge AI era, continuously empowering innovation across the global smart device ecosystems.
