At the recent 2026 International Integrated Circuit Exhibition and Conference (IIC Shanghai) in Shanghai, the BIWIN Mini SSD was awarded “Memory of the Year”. This recognition highlights the industry’s strong endorsement of the BIWIN Mini SSD’s technological innovation and market value, and affirms BIWIN’s continued commitment to advancing storage technologies and driving industry transformation.
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Redefining SSD Architecture and Form Factors
BIWIN Mini SSD Earns Multiple International Awards
The China IC Design Achievement Awards has been deeply rooted in the industry for 24 years, and is one of the most prestigious professional awards in China. It recognizes companies and products which demonstrate outstanding achievements in technological innovation, market application, and industry contribution. Among its core award categories, the “Memory of the Year” award honors products that showcase innovative storage design, scalable commercialization capabilities, and meaningful contributions to technological advancement within the storage industry.
The BIWIN Mini SSD redefines the conventional trade-off between performance, size, and expandability in traditional storage products. Through the combined innovation of advanced packaging technologies and innovative storage architecture, the BIWIN Mini SSD delivers a compact, high-performance, and expandable storage solution tailored for edge devices such as AI PCs and handheld gaming systems. It effectively addresses the limitations of oversized M.2 SSDs, the performance bottlenecks of microSD cards, and the lack of flexible scalability in UFS and eMMC solutions.
- Ultra-Compact Form Factor with Flagship Performance: Available in capacities upto 2 TB and with sustained speeds of 3,700 MB/s read and 3,400 MB/s write, the BIWIN Mini SSD is just 40% of the size of an M.2 2230 SSD and has an ultra-lightweight design of approximately 1 gram.
- Rugged Protection with Reliable Stability: Featuring IP68-rated dust and water resistance, 3-meter drop protection, and durability exceeding 12,000 insertion/removal cycles, the BIWIN Mini SSD ensures dependable operation across demanding mobile scenarios.
- Effortless Expansion with an Enhanced User Experience: Its industry-first standardized modular slot design enables simple and fast TB-level storage upgrades without professional tools, significantly improving device serviceability and long-term usability.
The BIWIN Mini SSD has earned multiple prestigious international awards, including TIME’s Best Inventions of 2025, the CES 2026 TWICE Picks Award, Embedded World Best in Show, and MWC 2026 Best in Show. It was also recognized as a 2026 Edison Bronze Award winner, widely regarded as the “Oscars of Innovation.” This latest recognition from one of China’s most authoritative semiconductor industry awards further validates the Mini SSD’s forward thinking design, spanning technological innovation, product vision, and commercial potential.
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Accelerating Product Iteration and Ecosystem Integration
Advancing the BIWIN Mini SSD Towards a Global Standard
The BIWIN Mini SSD is more than an innovative product: it represents the foundation of an open ecosystem. It has already been commercially deployed across AI PCs, handheld gaming devices, and other edge computing applications, empowering leading brands including One-Netbook, GPD, and Waterworld. But it’s just getting started.
To accelerate industry adoption, BIWIN has partnered with major ecosystem leaders such as Intel, Longcheer, BYD Electronics, and Luxshare to jointly advance the Mini SSD ecosystem in three key areas:
- Standardizing Specifications to Reduce Integration Costs: By establishing a dedicated IP company and introducing incentive and royalty-sharing mechanisms, BIWIN aligns the interests of ecosystem partners while opening technical specifications and interface standards to reduce barriers to integration and streamline adoption.
- Accelerating AI Device Adoption for Scalable Deployment: Focusing on key application scenarios including AI PCs, intelligent robotics, and handheld gaming devices, BIWIN will work closely with ecosystem partners to accelerate technical validation and deployment, driving large-scale adoption of the Mini SSD across key application sectors.
- Driving Performance Evolution to Strengthen Product Competitiveness: BIWIN is planning PCIe Gen 4×4 and Gen 5×4 interface enhancements for the Mini SSD to further increase interface bandwidth. Advanced 32-die stacking packaging technology will enable the development of 4 TB and higher-capacity Mini SSD solutions, too.
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Built on Full-Stack Technologies
Empowering Customers Across “End-to-Edge-to-Cloud” Scenarios
The success of the BIWIN Mini SSD is built upon BIWIN’s full-stack capabilities spanning integrated R&D, packaging, and testing. BIWIN continues to reinforce its innovation capabilities through intensive and sustained R&D investment, with 2025 R&D expenditure reaching RMB 632 million (Around USD 93.5 million), up 41.34% year over year. To date, BIWIN has secured 521 domestic and international patents alongside 66 software copyrights.
Through continuous advancement in core areas including storage solution development, chip design, and advanced packaging and testing, BIWIN has established a comprehensive storage portfolio covering emerging AI edge devices, smart consumer electronics, industrial and automotive-grade applications, as well as enterprise-class solutions. Backed by strong technology commercialization opportunities and market competitiveness, BIWIN delivers deep support for customers across end-to-edge-to-cloud application scenarios.
In emerging AI edge-device applications, BIWIN leverages the synergistic advantages of its ePoP series ultra-thin stacked packaging technology and low-power firmware algorithms to serve as a core storage solution provider for global industry leaders. Key BIWIN storage technologies precisely address the demands of AI glasses, smartwatches, and other wearable devices for ultra-thin form factors, low latency, and extended battery life.
In the intelligent automotive sector, BIWIN products now form core components in the supply chains of more than 20 leading domestic automakers and core Tier 1 suppliers, enabling large-scale delivery and commercialization of automotive-grade storage solutions.
On the cloud side, BIWIN’s enterprise storage products have been successfully integrated into the core supply systems of leading OEMs, AI server manufacturers, and major Internet companies, achieving volume shipments at scale.
Winning the 2026 China IC Design Achievement Award for “Memory of the Year” further validates the technological strength and market value of the BIWIN Mini SSD. BIWIN will continue to uphold its long-term innovation strategy, addressing the evolving demands of the AI era through technological advancement and innovation, and enhancing long-term enterprise value.
