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TGE408 eMMC 5.1

Industrial-grade eMMC 5.1 with wide-temperature reliability and enhanced endurance

Flexible pSLC and TLC configurations
Reliable Operation from -40°C to +85°C
Proprietary controller and firmware architecture
  • Capacity
    8 GB pSLC16 GB pSLC64 GB TLC128 GB TLC
  • Flash Type
    pSLC / TLC
  • Operating Temperature
    -40°C to +85°C

Overview

The BIWIN TGE408 eMMC 5.1 integrates a fully in-house developed eMMC controller with NAND flash, packaged in a compact FBGA 153-ball form factor. Compliant with the eMMC 5.1 specification and supporting HS400 high-speed mode, it delivers strong and reliable performance across an extended industrial temperature range of -40°C to +85°C.

Powered by proprietary firmware algorithms, the TGE408 eMMC 5.1 features advanced bad block management, wear leveling, garbage collection (GC), LDPC error correction, and power-loss protection technologies for dependable performance and data integrity, even in demanding industrial environments.

The series also supports BIWIN’s Win-pSLC endurance architecture, enabling TLC NAND to operate in an SLC-emulated mode for significantly enhanced performance, reliability, and endurance. Designed for mission-critical industrial applications, the TGE408 eMMC 5.1 is well suited for power and energy systems, industrial automation, and other stability-sensitive deployments, providing a secure and highly reliable storage solution for industrial platforms.

  • 01

    BIWIN Firmware Delivers Enhanced Performance and Reliability

    BIWIN’s proprietary Win-pSLC firmware technology allows TLC NAND to operate in an SLC-emulated mode, significantly enhancing read/write performance and system responsiveness. This architecture boosts high-speed data processing capabilities while substantially improving endurance and reliability. Designed for write-intensive and high-workload industrial applications, it enables stable, long-term operation even under continuous data access and frequent read/write cycles.
  • 02

    Wide-Temperature Operation In Extreme Conditions

    Built for industrial-grade reliability, the TGE408 eMMC 5.1 is rated for wide temperature range support of -40°C to +85°C. Combined with BIWIN’s proprietary high- and low-temperature optimization algorithms, it maintains stable performance and data integrity under extreme environmental conditions.
  • 03

    End-to-end In-House Design for Industrial Reliability

    The TGE408 eMMC 5.1 combines BIWIN’s proprietary controller with NAND flash, delivering a storage solution from chip design to manufacturing. This vertically integrated approach ensures greater supply chain control, long-term reliability, and consistent product quality. Built to withstand the demands of complex power and industrial environments, the TGE408 eMMC 5.1 provides secure data storage and stable data transmission under even intensive operating conditions.
  • 04

    Flexible Customization Options for Diverse Applications

    Powered by BIWIN’s proprietary controller and firmware architecture, the TGE408 eMMC 5.1 supports multi-level customization to meet specific application requirements. Customers can tailor features and performance characteristics to the needs of their deployment scenarios, enabling optimized storage solutions for power monitoring, industrial automation, diagnostic monitors, portable medical devices, in-vehicle infotainment (IVI) systems, and other specialized industrial applications. This flexibility helps achieve system integration while maximizing overall application value.

  • Bad Block Management

  • Power Loss Protection

  • Global Wear Leveling

  • RPMB Partition

  • FFU (Field Firmware Update)

  • ECC (Error Correction Code)

  • Electric Power

  • Industrial Robots

    Industrial Robots

  • Intelligent Surveillance

  • Rail Transportation

  • AIoT

  • Financial Retail Equipment

  • Smart Healthcare

    Smart Healthcare

Specifications

Latest Update: 2026/07/20
Product Line
Embedded
Product Grade
Industrial Wide-temp
Model Name
TGE408
Interface
eMMC 5.1
Flash Type
pSLC / TLC
Capacity
8 GB / 16 GB (pSLC Mode)
64GB / 128 GB (TLC Mode)
Sequential Read (Up to)
330 MB/s
Sequential Write (Up to)
220 MB/s
Operation Current (Max.)
120 mA
Standby Current (Max.)
130 μA
Dimensions
11.50 x 13.00 x 1.10 mm
Packaging
FBGA 153 Ball
Operating Temperature
-40°C to +85°C
Storage Temperature
-40°C to +85°C
Endurance
3,000 P/E cycles (TLC Mode); 100,000 P/E cycles (pSLC Mode)
MTBF
>3,000,000 hours
Certifications
RoHS, REACH
Warranty
3-Year Limited

Order Information

Capacity

8 GB pSLC
16 GB pSLC
64 GB TLC
128 GB TLC

Part Number

BWEFMI008GN929
BWEFMI016GN929
BWEFMI064GN929
BWEFMI128GN929

Power-Loss Protection Options

Firmware Based
Firmware Based
Firmware Based
Firmware Based
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

Documents

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Date
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Embedded BIWIN TGE408 eMMC 5.1 Specifications 2026-07-10 Download

Related Products

BIWIN produces high-quality NAND Flash storage solutions and is recognized across enterprise, embedded, consumer, and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms.

©BIWIN STORAGE TECHNOLOGY CO., LTD.

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