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uMCP (UFS 3.1 + LPDDR5X)

Built for flagship mobile devices requiring high-speed performance, compact integration, and optimized power efficiency.

UFS 3.1 + LPDDR5X integrated architecture
11.50 x 13.00 mm compact 297-ball FBGA package
128 GB - 512 GB capacity options
  • Capacity
    128 GB + 64 Gb256 GB + 64 Gb512 GB + 64 Gb
  • Operating Temperature
    -25°C to +85°C

Overview

The BIWIN uMCP (UFS 3.1 + LPDDR5X) (297-Ball) series is a highly integrated Multi-Chip Package (MCP) storage solution combining UFS 3.1 flash storage with the latest-generation LPDDR5X ultra-low-power mobile DRAM. Built in a compact 11.50 × 13.00 mm 297-ball FBGA package, BIWIN uMCP (UFS 3.1 + LPDDR5X) is specifically designed for premium mobile devices requiring both high performance and space-efficient board design.

Current configurations are built on the SM2753 controller platform, with capacity combinations ranging from 128 GB + 64 Gb to 512 GB + 64 Gb. BIWIN also specializes in customized solutions based on customer requirements.

Delivering high data throughput, ultra-low latency, and improved power efficiency, BIWIN uMCP (UFS 3.1 + LPDDR5X) is well suited for next-generation flagship smartphones, premium tablets, and other advanced smart devices with demanding storage and memory performance requirements.

  • 01

    Ultra-Compact Multi-Chip Package

    By combining UFS 3.1 flash and LPDDR5X DRAM into a single package, BIWIN uMCP (UFS 3.1 + LPDDR5X) delivers powerful performance in a more compact 11.50 x 13.00 mm 297-ball FBGA form factor. Its highly integrated design reduces PCB footprint and routing complexity, creating more space for larger batteries and slimmer designs, enabling next-generation mobile hardware.
  • 02

    Flagship Controller, Cutting-edge Performance

    Powered by the Silicon Motion SM2753 flagship controller platform designed for high-end embedded applications, BIWIN uMCP (UFS 3.1 + LPDDR5X) leverages cutting-edge LPDDR5X and UFS 3.1 to accelerate multitasking, large game loading, and AI computing workloads with smooth, responsive performance. The package delivers almost a 50% increase in DRAM bandwidth and doubles UFS storage speeds compared to previous-generation hardware.
  • 03

    Flexible Multi-Die Architecture for Scalable Package Capacity

    Designed to support a wide range of application tiers, BIWIN uMCP (UFS 3.1 + LPDDR5X) features flexible multi-die NAND configurations with storage capacities of 128 GB, 256 GB, and 512 GB. Paired with a 64 Gb LPDDR5X DRAM configuration, it delivers the memory and storage scalability required for devices ranging from mid-range to flagship mobile platforms. Capable of handling data-intensive 5G workloads, multiple high-res cameras, and AR/VR applications for mainstream smartphones.
  • 04

    Optimized Power Efficiency

    Leveraging the advanced power architecture of LPDDR5X and deep firmware optimization of the controller platform, BIWIN uMCP (UFS 3.1 + LPDDR5X) delivers sustained performance with improved power efficiency (KIOPS/Watt). The optimized power profile helps extend battery life and avoids thermal throttling under sustained high performance demands.

  • UFS 3.1

  • LPDDR5X

  • Quick Erase

  • FBGA

  • Advanced Die Stacking

  • Intelligent Power Management

  • Smart Phone

  • Tablet

  • AR/VR

  • Intelligent automotive cockpit systems

  • IoT

  • Autonomous Mobile Robots

  • Edge-AI Vision systems

Specifications

Latest Update: 2026/06/17
Product Line
Embedded
Product Grade
Consumer
Model Name
uMCP (UFS 3.1 + LPDDR5X) (297-ball)
Interface
UFS 3.1 + LPDDR5X
DRAM Type
LPDDR5X
NAND Type
UFS 3.1
Capacity
128 GB + 64 Gb
256 GB + 64 Gb
512 GB + 64 Gb
Dimensions
11.50 × 13.00 mm
Controller
SM2753
Packaging
297 ball FBGA
Operating Temperature
-25°C to +85°C
Certifications
CE, FCC, RoHS, REACH, WEEE, HF, China RoHS

Order Information

Capacity

128 GB+64 Gb
256 GB+64 Gb
512 GB+64 Gb

Part Number

BW3A2EYAKG-128G
BW3A2EYAKG-256G
BW3B1MYAKG-512G
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

Documents

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Embedded BIWIN uMCP (UFS 3.1+ LPDDR5X) Specifications 2026-06-17 Download

Related Products

BIWIN produces high quality NAND flash storage and is now known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.

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