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eMMC 5.1

Embedded MultiMediaCard (with NAND flash memory and controller), a compact and cost-effective storage solution

Space-Saving Footprint
Low Power Consumption
Capacity up to 512 GB
  • Capacity
    4 GB8 GB 16 GB32 GB64 GB128 GB256 GB512 GB
  • Flash Type
    3D TLC
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN eMMC 5.1 is an embedded storage solution combining high-quality flash memory and a flash memory controller to save motherboard space and assist device miniaturization. The eMMC complies with the JEDEC standards, simplifying terminal device design and qualification certification processes, accelerating time-to-market, and reducing overall cost. BIWIN eMMC offers capacities up to 512 GB, with low power consumption, supporting extended device battery life. eMMC is a popular solution for many electronic devices, including smartphones, tablets, automotive electronics, IoT, wearable devices, set-top boxes, and more.

  • 01

    High-Speed Read/Write with HS400 Support

    BIWIN eMMC 5.1 adopts the advanced eMMC 5.1 standard, supporting the High-Speed 400 (HS400) DDR Mode, with read and write speeds of up to 300 MB/s and 250 MB/s, respectively. It offers excellent compatibility and reliability, and is backward compatible with previous modes, such as HS200.
  • 02

    High Integration for Space Efficiency

    Featuring a standardized BGA package with dimensions of 11.5 × 13.0 mm, the design integrates both the flash memory die and the controller, significantly reducing the footprint and saving valuable space in terminal devices. This integration supports the miniaturization and slimming of devices, facilitating more efficient designs.
  • 03

    Wide Compatibility

    BIWIN eMMC 5.1 offers wide compatibility and flexible hardware adaptability. It can be used across different devices and systems, supporting multiple NAND flash types, including MLC, TLC, and QLC, providing a versatile solution for a wide range of applications.
  • 04

    Proprietary Firmware Algorithms

    The BIWIN eMMC 5.1 incorporates proprietary firmware algorithms that provide deep control and intelligent scheduling of the storage architecture. These algorithms can be customized based on specific application scenarios, delivering enhanced performance, extended lifespan, stability, and reliability for an optimized storage experience.
  • 05

    Customizable Solutions

    BIWIN provides customizable services that optimize cost-effectiveness by adjusting both capacity and performance to meet specific needs. Through advanced firmware customization, BIWIN enhances security, reliability, and boot speed, offering device manufacturers the flexibility to fine-tune their products to precise specifications.

  • Write Protection

  • Quick Erase

  • Wear Leveling

  • Garbage Collection

  • TRIM Command

  • Mobile Phone

    Mobile Phone

  • Tablet

    Tablet

  • Laptop

    Laptop

  • Digital Set-Top Box

    Digital Set-Top Box

  • Security Surveillance

    Security Surveillance

  • Smart Wearable

    Smart Wearable

  • Educational Electronics

    Educational Electronics

  • Gaming and Entertainment

    Gaming and Entertainment

  • Industrial Automation

    Industrial Automation

  • Network Communications

    Network Communications

  • Automotive Electronics

    Automotive Electronics

Specifications

Latest Update: 2025/08/29
Product Line
Embedded
Product Grade
Consumer
Model Name
eMMC 5.1
Interface
eMMC 5.1
Flash Type
3D TLC
Firmware
SLC Cache
Capacity
4 GB
8 GB
16 GB
32 GB
64 GB
128 GB
256 GB
512 GB
Sequential Read (Up to)
300 MB/s
Sequential Write (Up to)
250 MB/s
Operating Voltage
VCC=2.7 V-3.6 V
VCCQ=1.7 V-1.95 V/2.7 V-3.6 V
Dimensions
8.00 × 7.50 mm, 11.50 × 13.00 mm, 7.50 × 8.00 mm, 9.00 × 11.00 mm
Packaging
FBGA 153 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Supported Platforms
Allwinner, Amlogic, ASR, BES, Eeasytech, Gokemicro, Hisilicon, Ingenic, JQL, Mediatek, Qualcomm, Rockchip, Sifli, Unisoc, Horizon. etc
Warranty
3-Year Limited

Order Information

Capacity

4 GB
8 GB
16 GB
32 GB
64 GB
128 GB
256 GB
512 GB

Part Number

BWCMAB811G04G
BWCMMQ511G08G
BWCTAK611G16G
BWCTARJ11X32G
BWCTAKC11X64G
BWCTAKL11X128G
BWCTAKL21X256G
BWCTAKL41X512G

Packaging

FBGA153
FBGA153
FBGA153
FBGA153
FBGA153
FBGA153
FBGA153
FBGA153

Dimensions

11.50 × 13.00 mm
9.00 × 11.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

Documents

All Types

  • All Types
  • Specifications
Type
Title
Date
 Operate
Specifications BIWIN eMMC 5.1 Specifications 2026-01-06 Download

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