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BIWIN
Mar 23, 2026
Card Package
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BIWIN
Mar 23, 2026
Flip Chip-Chip Scale Package (FCCSP)
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BIWIN
Mar 23, 2026
Flip-Chip Ball Grid Array (FC-BGA)
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BIWIN
Mar 23, 2026
Wire Bonding Ball Grid Array (WB-BGA)
BIWIN produces high quality NAND flash storage and is now known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.

©BIWIN STORAGE TECHNOLOGY CO., LTD.

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