Compact, Reliable, and Customized

Memory & Storage Solution for AI infrastructure, CPE devices, and Beyond

Flexibility to Meet Diverse Deployment Needs

World-class Manufacturing Capabilities

Precision Manufacturing, Powered by in-house R&D

Two Owned Factories Specializing in Advanced Packaging& Testing

Smaller Size, Faster Speed

Ultra-Mini Storage Solution

Powering Smart Vehicles with Reliable Storage

Smart Storage for Smart Devices

Tough Environments, Tougher Storage Solutions

Custom Storage for PC OEMs

Infinite Storage, Unlimited Solutions

ABOUT
BIWIN

BIWIN Storage Technology Co., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high-quality NAND Flash storage solutions and is recognized across enterprise, embedded, consumer, and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms.

BIWIN’s product portfolio encompasses PCIe NVMe SSDs, SATA SSDs, enterprise SSDs, DRAM modules, embedded storage solutions (ePoP/eMMC/UFS), portable SSDs, memory cards, and USB flash drives.

Driving the Future with Cutting-Edge Storage Solutions

Applications

Elevate your systems with BIWIN’s next-gen storage technology, optimized for speed, durability, and seamless integration

Mobile Smart Terminals

Advanced storage for premium mobile devices, engineered for efficiency and high performance. Compact and energy-efficient, our solutions ensure fast, reliable, and efficient operation

Mobile Smart Terminals

High-End Computing

High-speed storage tailored for high-end systems. With exclusive licenses from Acer, Predator and HP, our solutions ensure optimized storage for demanding gaming and professional applications

High-End Computing

Enterprise Servers & Data Centers

High-performance storage designed for data centers, optimizing IOPS, power efficiency, and cost-effectiveness. Offering high capacity, low power consumption, and extended lifespan for seamless data transfer

Enterprise Servers & Data Centers

Automotive Electronics

Automotive-grade storage solutions engineered for reliability in extreme conditions. Ideal for connected vehicles, infotainment, and autonomous driving, delivering consistent performance in harsh environments

Automotive Electronics

Industrial Applications

Rugged, reliable storage solutions engineered for extreme conditions, operating under temperature extremes, high vibration, and dust exposure, ensuring durability and energy efficiency

Industrial Applications

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For decades, Biwin has built the critical storage and memory in many of the leading digital devices that have defined our digital world. Our consumer brand brings you the best of our experience, a range of SSDs, DRAM, memory cards, USBs, and related accessories that will help you get the most out of your devices.
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Predator is a high-end gaming brand owned by the world-renowned PC manufacturer Acer. With a respected series of premium products for hardcore gamers and enthusiasts, the Predator brand is recognized as a leader in the gaming community by experts and influencers.
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Established in 1987, the Acer brand empowers people with the technology to make their mark and with the freedom to live their desired lifestyle. Acer-branded products strive to make technology accessible to everyone.
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HP is one of the world’s leading IT companies and consistently ranks among the global Fortune 500. Its business spans IT infrastructure, storage solutions, commercial and home computers, printers, digital imaging, and more. HP has long been a global leader in PC shipments and is trusted by enterprises and professionals worldwide.
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Building the Future of Innovation

MANUFACTURING FACILITIES

Greater Bay Advanced Technology (GBAT) Greater Bay Advanced Technology (GBAT)

Greater Bay Advanced Technology (GBAT)

Greater Bay Chiplet Company (GBCC) Greater Bay Chiplet Company (GBCC)

Greater Bay Chiplet Company (GBCC)

Location: Huizhou, Guangdong

Spanning 38,000 m² with a total building area of 110,000 m², GBAT is a leader in storage chip packaging and testing, specializing in multi-layer stacked die, ultra-thin die packaging, and multi-chip heterogeneous integration. Our state-of-the-art facility in Huizhou is equipped with industry-leading technologies, enabling us to achieve world-class yield rates and performance.
With over 1,400 employees, GBAT offers comprehensive System-in-Package (SiP), Hybrid BGA, and FC-CSP services to global semiconductor manufacturers. Our advanced manufacturing capabilities and proprietary testing algorithms drive innovation in the semiconductor industry, setting new standards for quality and efficiency.
GBAT is committed to empowering the next generation of storage technology by providing cutting-edge solutions that enhance product competitiveness and foster industry growth.

Location: Dongguan, Guangdong

GBCC is at the forefront of advanced semiconductor packaging, specializing in next-generation chiplet technologies. GBCC operates on a 100,000-square-meter site and will feature a state-of-the-art cleanroom facility covering 70,000 square meters.
Driven by a world-class team of engineers and R&D experts, GBCC excels in wafer-level integration of memory and computing technologies, offering comprehensive packaging and testing services. We are dedicated to providing innovative solutions that enhance efficiency and performance for next-generation semiconductor applications.
GBCC is committed to becoming the benchmark for advanced packaging in the Greater Bay Area, setting the standard for memory and computer chip integration.

Driving Innovation Through Expertise

R&D CAPABILITIES

Innovation-Driven R&D

At the core of R&D capabilities lies the relentless pursuit of innovation. From advanced chip integration to next-generation packaging technologies, the focus is on pushing the boundaries of what’s possible.
World-class packaging solutions and advanced testing capabilities deliver superior quality and consistent performance that surpass industry benchmarks across diverse applications.

Ongoing firmware development and algorithm optimization enhance system integration, efficiency, and functionality, ensuring seamless performance across various platforms and achieving optimal results.

Precision-engineered solutions are developed to address specific industry needs. Rapid adaptation to market dynamics facilitates the delivery of products that drive competitiveness and align with evolving trends.
By streamlining processes from concept to production, the integrated R&D model accelerates time-to-market while maintaining exceptional standards of quality, efficiency, and performance.

Delivering Cutting-Edge Solutions Worldwide

GLOBAL OFFICES

Headquarters 2
R8D Centers 4
Manufacturing Plants 6
Service Centers 6
Local Presence 22
2
Headquarters
4
R8D Centers
6
Manufacturing Plants
6
Service Centers
22
Local Presence
Asia
Regional Office
21
North America
Global Headquarters
7
Europe
R&D and Logistics
6
South America
Emerging Market
6
PRESENCE BY REGION
Asia
Regional Office
21
Shenzhen
Building #4, South Zone #2, Zhongguan Honghualing Industrial Zone, Nanshan District, Shenzhen, Guangdong
support@biwintech.com
+86-755-2671 5701
Hong Kong
Unit 208-209,2/F, Block B, Po Lung Centre, 11 Wang Chiu Road, Kowloon Bay, Hong Kong
+852 2127-7895
Taiwan
3F, No. 162, Xinhu 2nd Rd., Neihu Dist., Taipei City 114065, Taiwan
support@biwintech.com
Huizhou
No. 25 Qiaofei Road, Chenjiang Subdistrict, Zhongkai High-Tech Zone, Huizhou, Guangdong
support@biwintech.com
Dongguan
No. 6 Xingye Road, Songshan Lake High-Tech Industrial Development Zone, Dongguan, Guangdong
support@biwintech.com
Chengdu
Room 912, 9th Floor, Incubation Park, High-tech Zone, Chengdu, Sichuan
Hangzhou
Room 308, Building D, IC Design Industrial Park, NO. 558 Jianshe Road, Xiaoshan District, Hangzhou, Zhejiang
Beijing
Room 201, Building 5, Yard 1, Shangdi 4th Street, Haidian District, Beijing
Shanghai
Room 331, 3rd Floor, Building 26, Gem Garden, No. 487 Tianlin Road, Xuhui District, Shanghai
Hangzhou
Room 330, Building 11, No. 4028, Nanhuan Road, Puyan Street, Binjiang District, Hangzhou, Zhejiang
Bangkok
Jinan
Hefei
Chennai
New Delhi
Dubai
Ho Chi Minh City
Manila
Istanbul
Shenzhen
Building #4, South Zone #2, Zhongguan Honghualing Industrial Zone, Nanshan District, Shenzhen, Guangdong Tel: +86-755-2671 5701
support@biwintech.com
Huizhou
No. 25 Qiaofei Road, Chenjiang Subdistrict, Zhongkai High-Tech Zone, Huizhou, Guangdong
support@biwintech.com
North America
Global Headquarters
7
Miami
8725 NW 18th Terrace Suite 400, Miami, FL 33172, U.S.A
support@biwintech.com
+1 (305) 456-3288
Fremont
4057 Clipper Court, Fremont, CA 94538
+1 (510) 979-9912
Los Angeles
Mexico City
Reynosa
Matamoros
Cupertino
Europe
R&D and Logistics
6
Frankfurt
Trier
Amsterdam
Derby
Brussels
Madrid
South America
Emerging Market
6
Bogotá
Quito
Lima
Buenos Aires
Manaus
São Paulo

Decades of Excellence, Pioneering Technological Progress

HISTORY

2025 - Now

  • BIWIN Mini SSD Named to TIME Best Inventions of 2025
  • Honored as an OpenCloudOS “Outstanding Ecosystem Partner 2025”
  • BIWIN Mini SSD Named to TWICE 2026 Picks Awards
  • BIWIN Mini SSD Named to Edison Bronze Awards 2026
  • BIWIN Mini SSD Won the 2026 China IC Design Achievement Award for Memory of the Year
2024

  • BIWIN TF200 Series microSD Cards certified for Raspberry Pi 4B AVL
  • Biwin consumer brand partners with Top Esports (TES) LOL Team
  • New BlWIN Corporate Logo Launch
  • Won “The Most Extensive Range Memory Solutions Provider of 2024 Award” at the 16th annual NCN-ICT
  • Won “Technology Innovation Excellence” from Meta 2024
2023

  • Named by 15th NCN-lCT “The Leading Flash Storage Manufacturer of 2022”
  • Weibo Gaming (WBG)adds Predator storage to its Pro eSports Team
  • BIWIN Huizhou (Storage Packaging and Testing Center) attains IATF16949Certification
  • Launched storage wafer-level advanced packaging 8 testing project in SongshanLake, Dongguan
  • Honored as “Fastest Growing Flash Storage 8 Manufacturer Brand” Awards bythe 15th DT Awards
  • Launched the Biwin consumer brand
2022

  • Public listing: Shanghai (SSE) STAR Market, Science and Technology Innovation Board (Stock Symbol: 688525)
  • “TOP10 Provider of Advanced Packaging and Testing 2022” by IC Rank
  • Won “Top Achiever Award for a Leading Manufacturer of Consumer Storage” at the 14th annual NCN-ICT
  • Honored as “Most Reliable Flash Storage Manufacturer Brand” Award by the 14th DT Awards
2020-2021

  • BIWIN 2.5″ SSD GS201 awarded as “Top Ten New Safe & Security Products”
  • BIWIN ePOP selected as “Top Embedded Memory Chips in China 2021″
  • BIWIN ePOP won the World Electronics Achievement Award “Memory of the Year”
  • BIWIN E009 BGA PCIe SSD named “Memory of the Year” at the China IC Design Achievement Award
  • Won the “Advanced Packaging and Testing Leading Enterprise Contribution Award” from the China Communications Industry Association
  • Signed Joint Training Agreement with Xidian University
  • The first BIWIN self-developed SSD—CK001 enters mass production.
2018-2019

  • Won the “2019 PConline Excellence Awards”
  • Won the “2018 CES Innovation Award”
  • Added by elexcon to the list: “Top 10 China Storage Chip Manufacturers”
  • BIWIN Huizhou Science & Technology Campus was recognized as one of the 2018 Provincial Key IC Projects by the Guangdong Provincial Development and Reform Commission
  • The construction of the BIWIN Science and Technology Campus in Huizhou has started, and after its completion, the monthly production capacity will reach 70 million
2016-2017

  • Passed the Business Social Compliance Initiative (BSCI) certification
  • BIWIN Shenzhen achieved IATF16949: 2016 Automotive Industry Quality System Certification
  • Obtained official license to produce HP brand SSD
2014-2015

  • Passed ISO9001: 2000 Quality System Certification
  • Added a specialized R&D center
  • Established its Taiwan Research and Development Center
2012-2013

  • Achieved ISO4001 Environmental Management and QC80000 Material Management Certifications
  • Recognized as a National High-tech Enterprise
2010-2011

The foundation and official launch of the Biwin brand in China

Explore the Latest in Storage Technology

EVENTS

  • CES 2026
  • embedded world 2026
  • MWC 2026

Global Partnerships for a Global Future

PARTNERS

Celebrating Excellence in Innovation

Awards & Recognitions

BIWIN’s success is driven by our relentless pursuit of innovation and excellence. We are committed to driving performance, enhancing user experience, and delivering innovative solutions that empower businesses worldwide.

TIME Best Inventions of 2025

BIWIN Mini SSD: Desktop-level Storage in A Tiny Footprint

Edison Bronze Awards 2026

BIWIN Mini SSD: Push the Boundaries of Compact Storage

Best of COMPUTEX 2026 by Arab Overclockers

BIWIN Mini SSD: New Innovations Powering the AI Era

CES 2026 TWICE Picks Award

BIWIN Mini SSD: Storage Innovation for Mobile Devices in AI Era

The 17th DT Awards 2025

The Most Preferred Flash Storage Solution Brand

Best-in-Show Awards from Embedded World North America 2025

BIWIN Mini SSD: Mini Yet Powerful SSD with PCIe 4.0

Best-in-Show Awards from Embedded World 2025

BIWIN ePOP4x: Ultra-Compact, High-Speed and Efficient Embedded Storage

The 17th NCN Innovative Product Awards 2024

The Cutting-Edge Memory & Storage Solutions Brand of 2024BIWIN ePOP4x: Ultra-Compact, High-Speed and Efficient Embedded Storage

The 16th DT Awards 2024

The Fastest Growing Flash Storage & Manufacturer Brand

Explore New Possibilities. Innovate with Us.