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TDE308 eMMC 5.1

Industrial eMMC 5.1 with 3D TLC, FFU Support, and Wide Temperature Stability

3D TLC for High-Speed Storage
Efficient Data Throughput
Wide-Temp Stability
  • Flash Type
    3D TLC
  • Capacity
    64 GB128 GB
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN TDE308 eMMC 5.1 features high-quality industrial-grade controllers and 3D TLC NAND, delivering sequential read speeds up to 325 MB/s and write speeds up to 260 MB/s. Designed for embedded and industrial applications, it supports a wide operating temperature range of -25°C to +85°C, ensuring stable performance despite harsh environments.

From firmware development to stringent testing and manufacturing, BIWIN ensures consistent quality and product reliability. The TDE308 incorporates BIWIN’s self-developed firmware, supporting Field Firmware Upgrade (FFU) and firmware area backup for safe and flexible in-field maintenance. The TDE308 supports Power Off Notification, a key feature allowing users to implement targeted data protection tailored to application needs.

With BIWIN’s own enhanced cross-temperature Read Retry (RR) algorithms, the TDE308 maintains high stability across temperature extremes. It is fully compatible with leading industrial CPUs, including Allwinner, RK, and SemiDrive, making it an ideal choice for industrial automation, data communication, energy infrastructure, and other mission-critical environments.

  • 01

    High-Performance Storage with Advanced Data Integrity

    The BIWIN TDE308 features the FBGA 153 ball package and adheres to the eMMC 5.1 protocol, offering high-performance storage for critical applications. Equipped with ECC for error detection and correction, it ensures data integrity and reliability for a seamless and dependable user experience.
  • 02

    Stable and Durable for Industrial Applications

    Designed for operation in wide temperature environments ranging from -25°C to +85°C, the BIWIN TDE308 leverages BIWIN’s proprietary cross-temperature Read Retry (RR) technology to enhance stability under extreme thermal conditions. It is fully compatible with various industrial CPUs, ensuring long-term, reliable performance despite demanding environments.
  • 03

    Comprehensive Data Protection for Consistent Reliability

    The BIWIN TDE308 features its proprietary firmware that supports online firmware updates (FFU) and enables firmware area backups. For enhanced data integrity and device reliability, TDE308 supports regular inspection of the User Data Area (UDA), Extended User Data Area (EUDA), BOOT Area, and Replay Protected Memory Block (RPMB), including data and entry validation.
  • 04

    Rigorous Quality Control for Industrial Reliability

    From wafer screening to final shipment, BIWIN’s industrial storage products strictly comply with international standards and adhere to a comprehensive quality management system. Each manufacturing process is executed with precision to ensure high reliability at every stage. Ongoing Reliability Testing (ORT) after mass production continuously monitors product performance, ensuring consistent stability and excellence throughout the product lifecycle.

  • FFU (Field Firmware Upgrade)

  • Power Off Notification

  • Firmware Backup

  • Read Retry (RR)

  • Industrial Automation

    Industrial Automation

  • Network Communications

    Network Communications

  • Smart Energy

    Smart Energy

  • Intelligent Transportation

    Intelligent Transportation

Specifications

Latest Update: 2025/08/30
Product Line
Embedded
Product Grade
Industrial Standard
Model Name
TDE308
eMMC Standard
eMMC 5.1
Flash Type
3D TLC
Capacity
64 GB
128 GB
Sequential Read (Up to)
325 MB/s
Sequential Write (Up to)
260 MB/s
Operation Current (Max.)
115 mA
Standby Current (Max.)
110 μA
Dimensions
11.50 x 13.00 x 1.10 mm
Packaging
FBGA 153 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Endurance
3000 P/E cycles
MTBF
>3,000,000 hours
Certifications
RoHS, REACH
Warranty
3-Year Limited

Order Information

Capacity

64 GB
128GB

Part Number

BWEFMD064GN729
BWEFMD128GN729

Power Loss Protection

Firmware-Based
Firmware-Based
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product life cycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. As used for storage capacity, one megabyte (MB)= one million bytes, one gigabyte (GB) = one billion bytes, and one terabyte (TB) = one trillion bytes. Total accessible capacity varies depending on the operating environment. As used for buffer or cache, one megabyte (MB) = 1,048,576 bytes. As used for transfer rate or interface, megabyte per second (MB/s) = one million bytes per second, and gigabyte per second (GB/s) = one billion bytes per second.
6. MTBF = Mean Time Between Failures based on internal testing using the Telcordia stress testing standard.
7. Please visit www.biwintechnology.com for warranty details in your region.
8. For more information, please contact sales@biwintech.com.

Documents

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  • Specifications
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Date
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Specifications BIWIN TDE308 Specifications 2025-12-29 Download

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