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  • TAU208 Automotive UFS 3.1

    TAU208 Automotive UFS 3.1

    UFS 3.1 Standard
    AEC-Q100 Compliance
    Durable in Harsh Conditions
    Learn More
    Read more
  • TAE308 Automotive eMMC 5.1

    TAE308 Automotive eMMC 5.1

    eMMC 5.1 Standard
    AEC-Q100 Compliance
    Durable in Harsh Conditions
    Learn More
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  • TAE318 Automotive eMMC 5.1

    TAE318 Automotive eMMC 5.1

    eMMC 5.1 Standard
    AEC-Q100 Compliance
    Durable in Harsh Conditions
    Learn More
    Read more
  • TAE208 Automotive eMMC 5.1

    TAE208 Automotive eMMC 5.1

    eMMC 5.1 Standard
    AEC-Q100 Compliance
    Durable in Harsh Conditions
    Learn More
    Read more
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  • Products
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    • Memory Card
    • DRAM Module
    • Embedded
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    • Embedded
      • Smart Wearables
      • Tablet
      • Wireless Communication
      • Commercial Display
      • Robot Vacuums
      • Voice Recorder
    • Industrial
      • Industrial Automation
      • Security Surveillance
      • Electric Power
      • Smart Healthcare
    • Automotive
      • Automotive Electronics
    • PC OEM
      • PC OEM
  • Assembly & Test
    • System-in-Package (SiP)
      • What is Semiconductor Packaging and Testing?
    • Processes & Capabilities
      • Die Preparation
      • Chip Interconnection and Protection
      • Package Assembly
      • Testing and Verification
    • Product Services
      • Wire Bonding Ball Grid Array (WB-BGA)
      • Flip-Chip Ball Grid Array (FC-BGA)
      • Flip Chip-Chip Scale Package (FCCSP)
      • Land Grid Array (LGA)
      • Card Package
    • Lab Services
      • Failure Analysis (FA)
      • Reliability Testing
      • Environmental Testing
  • Consumer Storage
    • Biwin Storage
    • Predator Storage
    • Acer Storage
    • HP Lenovo
  • Support
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BIWIN produces high-quality NAND Flash storage solutions and is recognized across enterprise, embedded, consumer, and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms.
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