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UFS 3.1

Over Four Times Faster Than UFS 3.0 with Lower Power Consumption

Up to 2100 MB/s Read & 1800 MB/s Write
Compact Size of 11.5 × 13.0 mm
Capacity up to 512 GB
  • Capacity
    128 GB256 GB512 GB
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN introduces its UFS 3.1 high-speed flash storage solution for flagship smartphones with write speeds up to 1800 MB/s, more than 4 times faster than previous-generation universal flash storage. It offers read speeds up to 2100 MB/s and capacities up to 512 GB, with a compact size of 11.5 × 13.0 mm. This solution is widely used in applications such as smartphones, tablets, smart cameras, AR/VR, smart vehicles, drones, and more.

  • 01

    High-Speed Read/Write

    BIWIN UFS 3.1 delivers sequential read speeds up to 2100 MB/s and sequential write speeds up to 1800 MB/s, providing performance that is significantly faster than previous-generation storage solutions. This makes it ideal for high-end smartphones, tablets, and VR/AR devices that demand high storage bandwidth.
  • 02

    Wide Compatibility

    Strictly adhering to JEDEC standards, the BIWIN UFS 3.1 ensures seamless compatibility with existing SoC platforms. Device manufacturers can easily upgrade from older UFS solutions without modifying hardware designs, unlocking the benefits of the latest flash memory technology with minimal development time and cost.
  • 03

    Low Power Consumption

    In DeepSleep mode, BIWIN UFS 3.1 reduces power consumption to ultra-low levels, offering exceptional energy efficiency and significantly extending battery life for mobile devices.
  • 04

    Cost Efficiency

    The HPB (Host Performance Booster) feature enhances performance by caching the mapping table in the device's memory, reducing read latency and boosting random read speeds. This improvement achieves significant performance gains without requiring costly high-end controllers, offering both cost-effectiveness and performance.

  • Write Protection

  • Quick Erase

  • Wear Leveling

  • Garbage Collection

  • TRIM Command

  • Mobile Phone

    Mobile Phone

  • Tablet

    Tablet

  • Laptop

    Laptop

  • Drone

    Drone

  • AR/VR

    AR/VR

Specifications

Latest Update: 2025/10/25
Product Line
Embedded
Product Grade
Consumer
Model Name
UFS 3.1
Interface
UFS 3.1
Capacity
128 GB
256 GB
512 GB
Sequential Read (Up to)
2100 MB/s
Sequential Write (Up to)
1800 MB/s
Operating Voltage
VCC = 2.4 V - 2.7 V
VCCQ = 1.14 V - 1.26 V
Dimensions
11.5 0 × 13.00 mm
Packaging
FBGA 153 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Supported Platforms
Mediatek, Unisoc, Qualcomm, Rockchip
Warranty
3-Year Limited

Order Information

Capacity

128 GB
256 GB
512GB

Part Number

BWU3AKG16D128G
BWU3AKG26D256G
WU3AKG46D512G

Packaging

FBGA153
FBGA153
FBGA153

Dimensions

11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

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