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eMCP LPDDR3

Power-Efficient Integrated Storage Solution for Embedded Applications

eMMC 5.1 + LPDDR3
Capacity up to 16 GB + 16 Gb
Space-Saving Footprint
  • Capacity (Up to)
    16 GB + 16 Gb
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN eMCP LPDDR3 integrates LPDDR3 DRAM and eMMC 5.1 storage, offering sequential read speeds up to 300 MB/s and sequential write speeds up to 160 MB/s, with frequency up to 1866 Mbps. This solution offers a maximum capacity of 16 GB+16 Gb with a compact size of just 11.50 × 13.00 mm, saving 84% of motherboard space compared to separate eMMC 5.1 and LPDDR3 configurations. It is an ideal choice for the miniaturization and slimmer design of smart devices, enhancing both performance and space efficiency.

  • 01

    High Integration, Space-Efficient Design

    The BIWIN eMCP integrates both eMMC and LPDDR3 into a single compact BGA package, significantly reducing the overall footprint. This high level of integration allows for more efficient designs in space-constrained smart terminals, enabling the development of sleeker, more portable devices.
  • 02

    Faster Data Transfer

    With an advanced point-to-point topology, the eMCP replaces the LPDDR2 fly-by architecture, directly improving signal quality. This design enables higher frequencies, boosting the device’s multitasking capabilities and accelerating data transfer speeds, making eMCP LPDDR3 very suitable for high-performance applications.
  • 03

    Advanced Signal Calibration for High-Speed Bandwidth

    This eMCP incorporates Write Leveling technology which automatically aligns the clock (CK) signal with the data strobe (DQS) signals during write operations. This leads to significantly improved data transfer reliability and bandwidth efficiency, ensuring more stable high-speed communication.
  • 04

    End-to-End Data Protection for Reliability

    The BIWIN eMCP supports end-to-end data protection mechanisms, delivering data integrity throughout its entire lifecycle from generation, through transmission, to storage. This comprehensive protection system significantly enhances both data storage and transfer, minimizing the risk of data loss or corruption.
  • 05

    Broad Compatibility and Versatile Application

    Rigorously tested and certified across major SoC platforms, the BIWIN eMCP offers exceptional compatibility and reliability. It is designed to meet the diverse demands of a wide range of smart terminal applications, delivering seamless integration across various cases.

  • S.M.A.R.T.

  • Firmware Update

  • End-to-End Data Protection

  • Data Erasure

  • Garbage Collection

  • Dynamic/Static Wear Leveling

  • TRIM Command

  • Bad Block Management

  • Intelligent Thermal Throttling

  • Gaming and Entertainment

    Gaming and Entertainment

  • Mobile Phone

    Mobile Phone

  • Tablet

    Tablet

  • Automotive Electronics

    Automotive Electronics

  • Educational Electronics

    Educational Electronics

  • Smart Wearable

    Smart Wearable

  • Drone

    Drone

Specifications

Latest Update: 2025/08/27
Product Line
Embedded
Product Grade
Consumer
Model Name
eMCP LPDDR3
Interface
eMMC 5.1 + LPDDR3
Capacity
16 GB + 16 Gb (Max.)
Performance (eMMC 5.1)
Sequential Read: 300 MB/s
Sequential Write: 160 MB/s
Performance (LPDDR3)
Up to 1866 Mbps
Operating Voltage (eMMC 5.1)
VCC=3.3 V
VCCQ=1.8 V
Operating Voltage (LPDDR3)
VDD1=1.70 - 1.95 V
VDD2=1.2 V
VDDQ=1.2 V
Dimensions
11.50 x 13.00 mm
Packaging
FBGA 221 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Supported Platforms
Allwinner, AutoChips, Leadcore, Spreadtrum, Rockchip, Unisoc, Mediatek, Qualcomm
Warranty
3-Year Limited

Order Information

Capacity

4GB+4Gb
8GB+8Gb
16GB+8Gb
16GB+16Gb

Part Number

BWCE24NL-04G
BWCE28NH-08G
BWCE28NH-16G
BWCE2ENH-16G

Packaging

FBGA221
FBGA221
FBGA221
FBGA221

Dimensions

11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

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