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UFS 2.2

Enhanced Performance with Faster Data Storage and Transfer, Especially for Mobile Devices

Up to 1000 MB/s Read & 800 MB/s Write
Compact size of 9.00 x 13.00 mm
Capacity up to 512 GB
  • Capacity
    64 GB128 GB256 GB512 GB
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN UFS 2.2 offers sequential read and write speeds up to 1000 MB/s and 800 MB/s, with capacities up to 512 GB. This solution is widely used in smartphones, tablets, smart cameras, AR/VR, smart vehicles, drones, and more.

  • 01

    High-Speed Read/Write with Smooth Data Transfer

    The BIWIN UFS 2.2 uses an advanced differential serial interface and adheres to the JEDEC standard, resulting in significant improvements in read and write speeds. This reduces system boot times, application load times, and large file transfer delays, providing a smooth and uninterrupted experience in high-speed data transfer scenarios.
  • 02

    Dual-Channel Mode for Enhanced Performance

    With its dual-channel operation mode, the BIWIN UFS 2.2 doubles the bandwidth at the same clock frequency, greatly enhancing I/O performance. This is especially effective for multitasking and parallel processing, boosting system responsiveness and overall fluidity.
  • 03

    Improved Write Performance for Faster Response

    Featuring WriteBooster technology, the BIWIN UFS 2.2 optimizes write performance, significantly accelerating data write speeds. This results in faster device responses, enhancing the overall user experience.
  • 04

    Large Capacity

    The BIWIN UFS 2.2 is available in capacities up to 512 GB, providing ample space to store large amounts of data. Its high capacity supports seamless performance in scenarios that demand large-scale data storage and rapid access.
  • Write Protection

  • Quick Erase

  • Wear Leveling

  • Garbage Collection

  • TRIM Command

  • Mobile Phone

    Mobile Phone

  • Tablet

    Tablet

  • Laptop

    Laptop

  • Drone

    Drone

  • AR/VR

    AR/VR

Specifications

Latest Update: 2025/10/25
Product Line
Embedded
Product Grade
Consumer
Model Name
UFS 2.2
Interface
UFS 2.2
Capacity
64 GB
128 GB
256 GB
512 GB
Sequential Read (Up to)
1000 MB/s
Sequential Write (Up to)
800 MB/s
Operating Voltage
VCC = 2.7 V - 3.6 V
VCCQ = 1.7 V - 1.95 V
Dimensions
11.5 0 × 13.00 mm
Packaging
FBGA 153 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Supported Platforms
Mediatek, Unisoc, Qualcomm, Rockchip
Warranty
3-Year Limited

Order Information

Capacity

64 GB
128 GB
256 GB
512GB

Part Number

BWU2A0516B064G
BWU2A0526B128G
BWU2A0546B256G
BWU2ANY46B512G

Packaging

FBGA153
FBGA153
FBGA153
FBGA153

Dimensions

11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
11.50 × 13.00 mm
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

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