Reliability Testing

Reliability testing is a critical phase in verifying the stable operation of products throughout their intended lifespan. The primary objective is to proactively identify and address potential defects and failure risks by simulating extended usage and exposure to extreme environmental conditions (before the product reaches the market). Successful results confirm the product will perform reliably and consistently across its entire lifecycle.

• Precondition Test: Functional testing, visual inspection, Scanning Acoustic Tomography (SAT), temperature cycling, bake, and moisture soak on parts. Pretreatment aims for analog parts from the transportation, storage, and reflow soldering before other reliability tests.
• High Temperature Storage Test: Accelerate aging of components under high temperature conditions. The purpose of this test is to verify the status of the thermal aging packaging materials in a continuous high-temperature state (to help maintain the stability of electrical performance and detect surface and bonding defects).
• Low Temperature Storage Test: Components are subjected to extremely low temperatures, causing mechanical deformation due to expansion and contraction. This test checks to see if cracks develop in the component structure.
• Temperature Humidity Storage Test: Inducing chemical reactions and corrosion by exposing the components to a hot and humid environment tests the corrosion resistance of the components.
• Highly Accelerated Stress Test: Similar in principle to the temperature humidity storage test, this test puts the product under pressure higher than atmospheric pressure during the humidification process. This accelerates corrosion and may expose poor packaging products that suffer from internal corrosion.
• Temperature Cycle Test: Parts are subjected to alternating high and low temperatures through coefficients of expansion, several cycles, which cause mechanical stress on components. This test can eliminate parts that fail due to temperature changes, such as those with issues in crystal grain, bonding wires, or packaging.
• Thermal Shock Test: Similar in principle to the temperature cycle test, this test accelerates the rate of temperature change. This test determines the resistance of electronic components to extreme high and low temperatures, and can detect defects like poor packaging seals, grain bonding, wire bonding, cracks, and other defects in the substrate.
• High Temperature Operating Life Test: Aging under high temperature and voltage simulates the operational state of components. This test aims to estimate the long-term reliability of a semiconductor component (accelerated stress conditions compress time to simulate a component’s lifespan).
• Vibration Test: Vibration test equipment, either in the lab or on-site, simulates the types of vibrations that packages can suffer during transportation, usage, and storage. This test reveals the reliability, durability, and safety of the product.
• Drop Test: To evaluate the durability and resilience of a product, we drop it from a specific height and assess the impact resistance and structural integrity shown in the fall.
• Thermal Warpage Measurement (Shadow Moiré): This test primarily simulates the detection of warping in substrates and components, and measures how the warping changes with temperature variations.
• 3-Point Bend Test: Use a material testing machine and strain gauges to assess the bending mechanical properties of product materials. This test measures the strength of the material when subjected to bending.