Addressing the rapidly evolving storage demands of AI-driven and data-intensive applications in 5G/6G base stations, enterprise data centers, and customer-premises equipment (CPE). BIWIN Storage Technology Co., Ltd. (“BIWIN”), will showcase its latest advancements in embedded memory, automotive, industrial, and enterprise-grade storage at MWC 2026, March 2nd to 5th, in Barcelona, Spain.
As the world’s premier exhibition and conference for the mobile communications industry, MWC 2026 brings together manufacturers, network operators, technology leaders, policymakers, and global media.
Empowering AI-enabled Devices with Higher-Performance Memory and Storage
BIWIN ePoP5X
BIWIN ePoP5x enables the future of AI-enabled devices with our industry-leading 0.54mm thinness defining the current state-of-the-art for wearables. It can be mounted directly on the main SoC, enabling ultra-thin and lightweight system designs. With flexible capacity options of 64 GB + 2 GB/3 GB/4 GB, it strikes an optimal balance between compact size and exceptional performance. Built to withstand the rigorous demands, the ePoP5x undergoes stringent reliability validation and full-process quality traceability, delivering resilience to drops and long-term wear encountered in wearables. This establishes a solid foundation for the large-scale deployment of AI AR glasses, smartwatches, and new AI devices.
BIWIN ePoP5x can be mounted directly on the main SoC, enabling ultra-thin and lightweight system designs. With flexible capacity options of 64 GB + 2 GB/3 GB/4 GB, it strikes an optimal balance between compact size and exceptional performance.
Built to withstand the rigorous demands, the ePoP5x undergoes stringent reliability validation and full-process quality traceability, delivering resilience to drops and long-term wear encountered in wearables. This establishes a solid foundation for the large-scale deployment of AI-AR glasses, smartwatches, and new AI devices.
Redefining Mobile Storage with Fast, Compact, High-Speed Solutions
BIWIN Mini SSD: Faster Speed, More Capacity for Smaller Next Gen Devices
Named to TIME’s list of Best Inventions of 2025, BIWIN Mini SSD represents a breakthrough in storage design, using LGA packaging technology to integrate the controller and flash memory into a super-compact form factor – the size of a small coin.
Measuring just 15.0 × 17.0 × 1.4 mm, this next-gen SSD can deliver impressive read speeds of up to 3700 MB/s and write speeds of up to 3400 MB/s. With IP68-rated dust and water resistance and the ability to withstand drops up to 3 meters, the Mini SSD meets the rigorous demand for size, speed and performance in industrial environments, mobile devices, and edge computing applications.
Enhancing Data Management and Storage Efficiency for Enterprises
BIWIN SP506/516 PCIe Gen 5 SSD:
For enterprises seeking high-capacity, high-speed storage solutions, the BIWIN SP506/516 series uses the PCIe Gen5x4 interface and offers double the bandwidth of PCIe Gen 4. With capacities ranging from 2 TB to 16 TB, these drives are built to meet the growing demands of next-generation data centers, AI applications, and cloud computing.
Featuring advanced security features like AES256 encryption, Secure Boot, and E2E Data Protection, the SP506/516 series ensures the highest standards of data protection and reliability.
Delivering Reliable Storage for Industrial, Automotive Applications
BIWIN TGS200 Wide-Temp SSDs Series:
The BIWIN TGS201 SSD features a 2.5-inch SATA III form factor, while the BIWIN TGS205-P SSD adopts a compact M.2 2242 SATA III design, ideal for space-constrained industrial systems. The BIWIN TGS203 SATA SSD offers a balanced combination of capacity and performance in a M.2 2280 form factor. All three models deliver sequential read and write speeds of up to 560 MB/s and 510 MB/s, and operate reliably across an extended temperature range of -40°C to +85°C, ensuring consistent performance in harsh and demanding environments.
The TGS200 Series is equipped with power-loss protection, safeguarding data against damage from unexpected power outages. Customization options, including conformal coating, sidefill/underfill and anti-sulfuration, provide comprehensive choices of additional solutions to enhance reliability and durability in harsh environments.
Designed for industrial-grade reliability, the BIWIN TGS200 Series integrates industrial-grade controllers and TLC NAND flash to support long-term, stable operation. The series is well suited for mission-critical applications such as industrial automation, rail transportation, metro gate systems, and 5G communication base stations, where durability and dependable performance are essential.
BIWIN TAU208 UFS 3.1:
The BIWIN TAU208 is a high-performance UFS 3.1 storage solution engineered for data-intensive smart vehicles. It delivers exceptional speed with 23.2 Gbps bandwidth (2,150 MB/s read), ensuring real-time processing for HD maps and autonomous driving streams. Built for reliability, it is AEC-Q100 compliant, operating flawlessly between -40°C and 105°C with robust LDPC and RAIN data protection. Its ultra-slim profile (as thin as 1.0 mm) ensures easy integration, while an advanced Deep Sleep mode cuts power consumption by 95%, making it highly efficient for modern electric vehicle architectures.
The TAU208 masters the critical balance between extreme performance and energy efficiency required by the software-defined vehicle era. As automakers race to optimize EV range, the TAU208’s 95% power reduction in sleep mode solves a major parasitic drain issue. Simultaneously, its server-grade speed (300K IOPS) and ability to withstand extreme thermal shock (-40°C to 105°C) provide the unshakeable reliability needed for safety-critical ADAS. It is not just storage; it is a foundational enabler for the next generation of autonomous driving.
Visit BIWIN at MWC 2026
Experience firsthand BIWIN’s latest storage innovations at MWC 2026. Visit us at Booth CS104 to explore our cutting-edge storage solutions for automotive, embedded, PC OEM, and enterprise applications.
About BIWIN
BIWIN Storage Technology CO., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high quality NAND flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
Our founders started in the flash storage business in 1995, in Shenzhen, China, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN.
In 2009, they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today.
