BIWIN Storage Technology Co., Ltd. (“BIWIN”), a leading innovator in embedded storage solutions, is pleased to announce its participation in Embedded World 2026, held from March 10th to 12th in Nuremberg, Germany.
As one of the world’s premier events for embedded systems and technologies, Embedded World brings together industry leaders to explore the latest innovations shaping the future of intelligent devices. At the event, BIWIN will present its newest advancements across embedded memory, automotive, industrial and enterprise storage — addressing the rapidly evolving demands of AI-driven devices and data-intensive applications.
Higher-Performance Memory and Storage for Newer Generations of AI-Enabled Devices
BIWIN ePoP5X
The BIWIN ePoP5X integrates LPDDR5X DRAM and eMMC storage into a single advanced package, enabled by BIWIN’s cutting-edge multi-die stacking, ultra-thin die processing, and heterogeneous multi-chip integration technologies. With an ultra-compact footprint of 8.0 mm × 9.5 mm and an ultra-thinness of just 0.54 mm, BIWIN ePoP5x consolidates traditionally discrete memory components into one highly miniaturized module—ideal for even space-constrained devices such as AI-powered AR glasses or smartwatches.
The ePoP5X significantly improves design flexibility for compact, high-performance systems by saving as much as 75% space on the PCB. The eMMC supports HS400 high-speed mode with data transfer rates of up to 400 MB/s, while LPDDR5X delivers data rates of up to 8533 Mbps. Supported by 16n / 32n-bit prefetch architectures, the solution ensures fast content loading and efficient processing of high-frequency workloads.
BIWIN ePoP5x enables the future of AI-enabled devices with our specific 0.54mm thinness defining the current state-of-the-art for wearables. It can be mounted directly on the main SoC, enabling ultra-thin and lightweight system designs. With flexible capacity options of 64 GB + 2 GB/3 GB/4 GB, it strikes an optimal balance between compact size and exceptional performance. Built to withstand the rigorous demands, the ePoP5x undergoes stringent reliability validation and full-process quality traceability, delivering resilience to drops and long-term wear encountered in wearables. This establishes a solid foundation for the large-scale deployment of AI AR glasses, smartwatches, and new AI devices.
Delivering More Reliable Storage for Automotive, Industrial Applications
BIWIN TAU208 UFS 3.1
The BIWIN TAU208 is a high-performance UFS 3.1 storage solution engineered for data-intensive smart vehicles. It delivers exceptional speed with 23.2 Gbps bandwidth (2,150 MB/s read), ensuring real-time processing for HD maps and autonomous driving streams.
Built for reliability, it is AEC-Q100 compliant, operating flawlessly between -40°C and 105°C with robust LDPC and RAIN data protection. Its ultra-slim profile (as thin as 1.0 mm) ensures easy integration, while an advanced Deep Sleep mode cuts power consumption by 95%, making it highly efficient for modern electric vehicle architectures.
The TAU208 masters the critical balance between extreme performance and energy efficiency required by the software-defined vehicle era. As automakers race to optimize EV range, the TAU208’s 95% power reduction in sleep mode solves a major parasitic drain issue. Simultaneously, its server-grade speed (300K IOPS) and ability to withstand extreme thermal shock (-40°C to 105°C) provide the unshakeable reliability needed for safety-critical ADAS. It is not just storage; it is a foundational enabler for the next generation of autonomous driving.
BIWIN TGC207 SD & TGC209 microSD Cards
BIWIN TGC209 microSD and TGC207 SD cards are built for applications requiring high reliability, high performance, and large capacity, such as surveillance systems and high-speed cameras. Both products support Full HD, 4K, and 8K video recording, and use industrial-grade 3D TLC NAND flash.
With Application Performance Class A1, these cards ensure stable, high-speed data writing without frame drops– and support video recording lifetimes of up to 90,000 hours, making them well suited for continuous-operation industrial environments.
Redefining Mobile Storage with Fast, Compact, High-Speed Solutions
BIWIN Mini SSD: Faster Speed for More Compact Storage Applications
Named to TIME’s list of Best Inventions of 2025, BIWIN Mini SSD represents a breakthrough in storage design, using LGA packaging technology to integrate the controller and flash memory into a super-compact form factor – the size of a small coin.
Measuring just 15.0 × 17.0 × 1.4 mm, this next-gen SSD can deliver read speeds of up to 3700 MB/s and write speeds of up to 3400 MB/s. With IP68-rated dust and water resistance and the ability to withstand drops up to 3 meters, the Mini SSD meets the rigorous demand for size, speed and performance in industrial environments, mobile devices, and edge computing applications.
Driving Innovation for PC OEMs with High-Speed Storage Solutions
BIWIN APX03 SSD:
BIWIN APX03 SSD exemplifies cutting-edge performance and reliability, powered by advanced 6nm process technology and 3D TLC NAND flash. Leveraging the PCIe Gen5x4 interface and NVMe 2.0, it unlocks the full potential of next-gen storage systems. With a compact M.2 2280 form factor, the APX03 delivers sequential read and write speeds up to 10000 MB/s and is available in capacities from 512 GB to 2 TB.
Built to meet the needs of premium laptops, gaming systems, and professional workflows, the APX03 offers exceptional performance while optimizing thermal efficiency and power consumption for longer battery life, delivering enhanced user experience across a variety of applications.
Enhancing Data Management and Storage Efficiency for Enterprises:
BIWIN SP506/516 PCIe Gen 5 SSD:
For enterprises seeking high-capacity, high-speed storage solutions, the BIWIN SP506/516 series uses the PCIe Gen5x4 interface and offers double the bandwidth of PCIe Gen 4. With capacities ranging from 2 TB to 16 TB, these drives are built to meet the growing demands of next-generation data centers, AI applications, and cloud computing. Featuring advanced security features like AES256 encryption, Secure Boot, and E2E Data Protection, the SP506/516 series ensures the highest standards of data protection and reliability.
Visit BIWIN at Embedded World 2026
Experience firsthand BIWIN’s latest storage innovations at Embedded World 2026. Visit us at Booth #1-140 to explore our cutting-edge storage solutions for automotive, embedded, PC OEM, and enterprise applications.
About BIWIN
BIWIN Storage Technology CO., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high quality NAND flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
Our founders started in the flash storage business in 1995, in Shenzhen, China, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN.
In 2009, they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today.
