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TAE308 Automotive eMMC 5.1

Automotive-Grade eMMC With High Capacity, Fast Data Transfer, and Durability for Demanding In-Vehicle Applications

eMMC 5.1 Standard
AEC-Q100 Compliance
Durable in Harsh Conditions
  • Flash Type
    3D TLC
  • Capacity
    64 GB128 GB
  • Operating Temperature
    -40°C to +105°C

Overview

BIWIN TAE308 eMMC 5.1 is built with high-quality 3D TLC NAND and our self-developed SP1800 controller. It is designed for a wide range of in-vehicle applications, including intelligent cockpit systems, in-vehicle infotainment (IVI), central control units, navigation, digital instrument clusters, T-BOX modules, and domain controllers.

Supporting HS400 high-speed mode, the TAE308 also features FFU, Boot Partition, RPMB, and idle data acceleration to optimize performance. Housed in a compact BGA package, the TAE308 offers capacities up to 128 GB to provide a high-density solution within a small footprint—critical for space-constrained automotive designs.

Designed to withstand the harsh conditions of vehicle environments, the TAE308 supports an operating temperature range of -40°C to +105°C, fully compliant with AEC-Q100 Grade 2 standards. The BIWIN TAE308 eMMC meets the stringent demands of automotive systems that require high endurance, low power consumption, high bandwidth, and long-term reliability.

  • 01

    High Performance with AEC-Q100 Compliance

    BIWIN TAE308 eMMC 5.1 strictly adheres to the eMMC 5.1 standard and is AEC-Q100 qualified. It supports HS400 high-speed mode, delivering faster data transfer rates to meet the demands of complex environments, including smart cockpit features and autonomous driving.
  • 02

    Large Capacity, Versatile Storage

    The BIWIN TAE308 eMMC 5.1 uses 3D TLC NAND technology to deliver stable, reliable storage while offering cost efficiency. With a maximum capacity of 128 GB, it is designed to meet the extensive data storage needs of modern automotive systems, including high-definition maps, video recording, and user data.
  • 03

    Data Integrity and Protection

    The BIWIN TAE308 eMMC 5.1 features a Boot Partition to ensure reliable and secure system booting. The RPMB (Replay Protected Memory Block) enables encrypted storage to protect user privacy, while the idle data acceleration feature further optimizes system performance for enhanced response speed.
  • 04

    High Durability, Stable Operation

    The BIWIN TAE308 eMMC 5.1 meets the Automotive Grade 2 temperature standards, operating within a range of -40°C to +105°C. This ensures exceptional durability and consistent performance in extreme environmental conditions. Designed to withstand high vibration, humidity, and other challenging factors, it is the ideal solution for automotive applications that demand stable operation in harsh environments.

  • Bad Block Management

  • Power Loss Protection

  • Global Wear Leveling

  • RPMB Partition (Replay Protected Memory Block)

  • FFU (Field Firmware Update)

  • ECC (Error Correction Code)

  • Smart Cockpit

    Smart Cockpit

  • IVI (In-Vehicle Infotainment)

    IVI (In-Vehicle Infotainment)

  • Central Control

    Central Control

  • Navigation

    Navigation

  • Autonomous Driving

    Autonomous Driving

  • Instrument Cluster

    Instrument Cluster

  • T-BOX

    T-BOX

  • Domain Controller

    Domain Controller

Specifications

Latest Update: 2025/08/30
Product Line
Embedded
Product Grade
Automotive
Model Name
TAE308
eMMC Standard
eMMC 5.1
Flash Type
3D TLC
Capacity
64 GB
128 GB
Sequential Read (Up to)
330 MB/s
Sequential Write (Up to)
220 MB/s
Operation Current (Max.)
115 mA
Standby Current (Max.)
85 μA
Dimensions
11.50 x 13.00 x 1.10 mm
Packaging
FBGA 153 Ball
Operating Temperature
-40°C to +105°C
Storage Temperature
-40°C to +105°C
Endurance
3000 P/E cycles
MTBF
>3,000,000 hours
Certifications
RoHS, REACH, AEC-Q100
Warranty
5-Year Limited

Order Information

Capacity

64 GB
128 GB

Part Number

BWEFMA064GN923
BWEFMA128GN923

Power Loss Protection

Firmware-Based
Firmware-Based
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. As used for storage capacity, one megabyte (MB)= one million bytes, one gigabyte (GB) = one billion bytes, and one terabyte (TB) = one trillion bytes. Total accessible capacity varies depending on the operating environment. As used for buffer or cache, one megabyte (MB) = 1,048,576 bytes. As used for transfer rate or interface, megabyte per second (MB/s) = one million bytes per second, and gigabyte per second (GB/s) = one billion bytes per second.
6. MTBF = Mean Time Between Failures based on internal testing using the Telcordia stress testing standard.
7. Please visit www.biwintechnology.com for warranty details in your region.
8. For more information, please contact sales@biwintech.com.

Documents

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  • Specifications
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Date
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Specifications TAE308 Specifications 2026-01-23 Download

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