201-ball ePoP5X

Embedded Package-on-Package (ePoP) LPDDR5X with a 201-ball configuration is a premier, highly integrated memory solution especially for flagship smartphones, AI wearables, and ultra-thin laptops. It combines LPDDR5X DRAM (speeds up to 8533 Mbps) with high-speed eMMC 5.1 (at 300 MB/s read speed) into a single, stacked component. BIWIN ePoP5X uses advanced packaging technologies such as multi-layer die stacking, ultra-thin dies, and heterogeneous multi-chip integration to create a package thickness of only 0.54 mm. Iits ultra-thin and compact design significantly reduces required PCB space, making it an ideal storage solution for the slim and lightweight design for wearables and other mobile devices.

The 201-ball package is specifically used for LPDDR5X-based ePoP to support the increased signal, power, and ground requirements of faster data rates in an extremely compact, thin, vertical space. It allows for efficient multi-layer die stacking of both LPDDR5X DRAM and storage, optimizing performance for AI-driven mobile devices. The 201-ball configuration fits into the 8x9.5 mm footprint used for advanced ePoP, which stacks the memory directly on top of the SoC to save PCB space.

This ePoP5X configuration is designed for the 16n prefetch architecture and enhanced data streaming, essential for AI and 5G applications. LPDDR5X requires more pins for high-speed signaling compared to LPDDR4X which often used 144 balls. With a higher pin count for signal lintegrity to ensure data integrity at faster speeds, the 201-ball design also accommodates improved power and ground mapping needed for the lower voltage (0.5V-0.6V) operation of LPDDR5X, reducing noise and improving stability. BIWIN ePoP5X also features global wear-leveling management and LDPC error correction algorithms, and supports FFU upgrades. These capabilities ensure stable operation during long-term and intensive usage, providing more reliable and more sustained high performance.

BIWIN provides professional hardware customization and packaging and testing services. Powered by our in-house developed firmware, it supports features such as faster boot, ultra-low power consumption, and SoC controller optimization. Customized versions can also be provided according to specific customer requirements, delivering more precise storage solutions for specific needs.