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eMCP LPDDR4X

Power-Efficient Integrated Storage Solution for Embedded Applications

eMMC 5.1 + LPDDR4X
Capacity up to 128 GB + 64 Gb
Compact Size: 11.50 x 13.00 mm
  • Capacity (Up to)
    128 GB + 64 Gb
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN eMCP LPDDR4X integrates LPDDR4X DRAM and eMMC 5.1 storage, offering sequential read speeds up to 300 MB/s and sequential write speeds up to 230 MB/s, with frequency up to 4266 Mbps. This solution offers a maximum capacity of 128 GB+64 Gb and a compact size of just 11.50 × 13.00 mm, saving substantial PCB space compared to separate eMMC 5.1 and LPDDR4X configurations. It is an ideal choice for the miniaturization and slimmer design of smart devices, enhancing both performance and space efficiency.

  • 01

    Compact and Space-Saving Design

    BIWIN eMCP uses advanced multi-chip packaging technology, integrating eMMC and LPDDR4X memory into a BGA package. This innovative design effectively reduces the module's dimensions, saving valuable space in smart terminal devices and supporting more efficient industrial design.
  • 02

    Enhanced Performance with Faster Data Transfer

    The eMCP integrates high-frequency, low-latency LPDDR4X with an LVSTL interface optimized for a 0.6V low voltage and enhanced signal integrity. With data transfer rates up to 4266 Mbps, this solution provides a significant performance boost compared to the previous generation LPDDR3 eMCP3, enhancing overall device responsiveness and performance.
  • 03

    Lower Power Consumption for Extended Battery Life

    By reducing the I/O voltage from 1.1 V in LPDDR4 to 0.6 V, the eMCP significantly lowers dynamic power consumption. This power efficiency ensures devices can maintain lower power consumption even while responding quickly to multiple data requests and multitasking, ultimately extending battery life.
  • 04

    Broad Compatibility for Diverse Applications

    Thoroughly tested and validated, the BIWIN eMCP offers exceptional reliability and broad compatibility. It is designed to meet the diverse demands of various smart terminal applications, offering seamless integration in a wide range of use cases.

  • S.M.A.R.T.

  • Firmware Update

  • End-to-End Data Protection

  • Data Erasure

  • Garbage Collection

  • Dynamic/Static Wear Leveling

  • TRIM Command

  • Bad Block Management

  • Intelligent Thermal Throttling

  • Gaming and Entertainment

    Gaming and Entertainment

  • Mobile Phone

    Mobile Phone

  • Tablet

    Tablet

  • Automotive Electronics

    Automotive Electronics

  • Educational Electronics

    Educational Electronics

  • Smart Wearable

    Smart Wearable

  • Drone

    Drone

Specifications

Latest Update: 2025/08/27
Product Line
Embedded
Product Grade
Consumer
Model Name
eMCP LPDDR4X
Interface
eMMC 5.1 + LPDDR4X
Capacity
128 GB + 64 Gb (Max.)
Performance (eMMC 5.1)
Sequential Read: 300 MB/s
Sequential Write: 230 MB/s
Performance (LPDDR4X)
Up to 4266 Mbps
Operating Voltage (eMMC 5.1)
VCC=3.3 V
VCCQ=1.8 V
Operating Voltage (LPDDR4)
VDD1=1.70 - 1.95 V
VDD2=1.06 - 1.17 V
VDDQ=0.57 - 0.65 V
Dimensions
11.50 x 13.00 mm
Packaging
FBGA 254 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Supported Platforms
Rockchip / Unisoc / Mediatek / Qualcomm
Warranty
3-Year Limited

Order Information

Capacity

32GB+16Gb
32GB+32Gb
64GB+32Gb
128GB+32Gb
128GB+64Gb

Part Number

BWCA2EZA-32G
BWCA2KZC-32G
BWCA2KZC-64G
BWCA2KZA-128G
BWCA2KZA-128G

Packaging

FBGA254
FBGA254
FBGA254
FBGA254
FBGA254
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

Documents

All Types

  • All Types
  • Specifications
Type
Title
Date
 Operate
Specifications BIWIN eMCP 4X Specifications 2026-01-06 Download

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