High-Performance, Automotive-Grade eMMC with 3D TLC NAND, Reliable, Fast Data Storage
The BIWIN TAE208, with the eMMC 5.1 standard for automotive-grade performance, is built with high-quality 3D TLC NAND. It’s designed for a wide range of in-vehicle applications, including intelligent cockpit systems, in-vehicle infotainment (IVI), central control units, navigation, digital instrument clusters, T-BOX modules, and domain controllers.
Supporting HS400 high-speed mode, the TAE208 also features FFU, Boot Partition, RPMB, and idle data acceleration to optimize performance. Housed in a compact BGA package, the TAE208 offers capacities up to 128 GB, providing a high-density solution for space-constrained automotive designs.
To withstand the harsh conditions of vehicle environments, the TAE208 supports an operating temperature range of -40°C to +105°C, fully compliant with AEC-Q100 Grade 2 standards. The BIWIN TAE208 eMMC meets the stringent demands of automotive systems and offers an impressive combination of high endurance, low power consumption, high bandwidth, and long-term reliability.








Type |
Title |
Date |
Operate |
|---|---|---|---|
| Specifications | BIWIN TAE208 Specifications | 2025-12-29 | Download |










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