BIWIN Storage Technology Co., Ltd. (“BIWIN”), a global leader in embedded storage solutions, will exhibit its latest memory and storage innovations at Embedded World North America 2025, taking place from November 4–6 at the Anaheim Convention Center in Anaheim, California.
As a trusted supplier to leading North American enterprises and industrial partners, BIWIN will present a comprehensive lineup of products engineered for embedded, automotive, and industrial applications. The company’s showcase highlights its commitment to advancing high-performance, power-efficient, and reliable storage solutions tailored for the evolving demands of next-generation embedded systems.
The BIWIN ePoP LPDDR4X combines LPDDR4X DRAM and eMMC 5.1 into a single 144-ball PoP package with capacities up to 64 GB+32 Gb. With a compact size of just 8.00 x 9.50 mm, it achieves sequential read and write speeds up to 290 MB/s and 140 MB/s, with a frequency up to 4266 Mbps. Compared to previous generations, this solution features a 128.6% increase in frequency, a 32% reduction in size, making it an ideal storage solution for the design of ultra-slim, lightweight smart wearable devices and next-generation mobile electronics.
BIWIN LPDDR5X delivers transfer speeds up to 8533 Mbps with 25% lower power consumption than LPDDR4X. With its compact FBGA package and low operating voltage (VDDQ 0.5 V), LPDDR5X supports next-gen mobile platforms requiring sustained data throughput and efficiency. Equipped with on-die ECC and advanced power scaling (DVFS, PASR), it offers both accuracy and endurance for high-performance devices such as flagship smartphones, laptops, tablets, 5G devices, and especially for AI applications.
BIWIN eMMC is an embedded storage solution combining high-quality flash memory and a flash memory controller to save motherboard space and assist device miniaturization with dimensions of 11.5 × 13.0 mm. It adopts the advanced eMMC 5.1 standard, supporting the High-Speed 400 (HS400) DDR Mode, with read and write speeds of up to 300 MB/s and 250 MB/s. BIWIN eMMC is a popular solution for many electronic devices, including smartphones, tablets, automotive electronics, IoT, wearable devices, set-top boxes, and more.
BIWIN Mini SSD has been named to TIME’s prestigious list of the Best Inventions of 2025, a recognition that celebrates innovations changing the way we live, work, and play. Selected from hundreds of global entries, the BIWIN Mini SSD stood out for its unprecedented combination of ultra-compact design, high-speed performance, and rugged durability, redefining what’s possible in portable storage.
At just 15.0 mm × 17.0 mm × 1.4 mm, the BIWIN Mini SSD integrates controller and NAND through LGA packaging, offering PCIe 4.0 x2, NVMe 1.4 performance in a micro form factor. With read/write speeds up to 3700/3400 MB/s, it delivers high-speed storage for running AI training tasks, editing 4K video, or executing large applications, bridging performance and portability. Built with advanced integrated packaging technology, the Mini SSD offers excellent resistance to shocks and impacts, while its IP68-rated dust and water resistance provides an additional layer of reliability in challenging environments.
BIWIN’s industrial and automotive SSD portfolio, including TGP205, TDP203, and TDQ203, is engineered for reliability under extreme environmental and workload conditions. Designed for long operating lifecycles, these drives deliver high-speed data transfer, power-loss protection, and stable operation across wide temperature ranges.
BIWIN TGP205 / TDP203 Industrial SSD:
For PC OEMs and client computing, BIWIN AP843 and AP683 bring high-speed PCIe SSD technology to mainstream and performance-driven platforms. Both feature low-power operation, intelligent thermal management, and firmware-level reliability controls for consistent, efficient system performance.
• PCIe Gen4×4, NVMe 2.0
• Up to 7000 MB/s Read and 6300 MB/s Write
• Lower Power Consumption
• Smart Thermal Management
• PCIe Gen3x4, NVMe 1.4
• Up to 3600 MB/s Read and 2900 MB/s Write
• Lower Power Consumption
• Advanced Technologies: Dynamic/Static Wear Leveling, TRIM Command, S.M.A.R.T., Intelligent Thermal Throttling, and Garbage Collection
Experience BIWIN’s latest embedded storage innovations at Embedded World North America 2025. Visit Booth #2010, Hall C-Level 1, to explore how BIWIN’s advanced flash technologies are empowering next-generation devices — from smart manufacturing and automotive electronics to edge AI and high-performance computing.
BIWIN Storage Technology CO., Ltd. (SSE STAR Market, Stock Symbol: 688525) produces high-quality NAND flash storage and is known in embedded, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.
Our founders started in the flash storage business in 1995, in Shenzhen, China, embracing the “WIN-WIN” business philosophy that would later become the hallmark for BIWIN.
In 2009, they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don’t have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today.
Leading the Future of Storage and Memory with Cutting-Edge Solutions. Infinite Storage, Unlimited Solutions
©BIWIN STORAGE TECHNOLOGY CO., LTD.
