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ePoP LPDDR4X

BIWIN ePoP LPDDR4X: Ultra-Compact, High-Speed Storage Solution for Next-Generation Devices

Up to 290 MB/s Read and 140 MB/s Write
Frequency up to 4266 Mbps
Ultra-Thin Form Factor
  • Capacity
    32 GB + 16 Gb64 GB + 16 Gb64 GB + 32 Gb
  • Operating Temperature
    -25°C to +85°C

Overview

BIWIN ePoP LPDDR4X integrates LPDDR4X DRAM and eMMC 5.1 storage into a Package-on-Package (PoP) solution with a 144-ball FBGA package. With a compact size of just 8.00 x 9.50 mm, it achieves sequential read and write speeds up to 290 MB/s and 140 MB/s, with frequency up to 4266 Mbps. BIWIN ePoP LPDDR4X offers capacity up to 64 GB+32 Gb. It is a next-generation storage solution designed for high-end smartwatches. Compared to previous generations, this solution features a 128.6% increase in frequency, a 32% reduction in size, and is certified by the Qualcomm 5100 platform.

  • 01

    Ultra-Thin Form Factor

    The BIWIN ePoP LPDDR4X employs cutting-edge packaging technologies, including multi-layer die stacking, ultra-thin die, and multi-chip heterogeneous integration. With a thickness of just 0.65 mm, this highly compact form factor significantly reduces required PCB space, making it an ideal storage solution for the design of ultra-slim, lightweight smart wearable devices and next-generation mobile electronics.
  • 02

    High Integration

    The BIWIN ePoP LPDDR4X integrates eMMC 5.1 and LPDDR4X into a single package, achieving data transfer speeds up to 4266 Mbps and read speeds up to 300 MB/s, offering smooth performance even in multi-threaded and high-load scenarios.
  • 03

    Exceptional Reliability and Stability

    Featuring global wear leveling, LDPC error correction algorithms, and FFU (Field Firmware Update), the BIWIN ePoP LPDDR4X delivers stable operation under long-term, high-intensity usage. These advanced features provide continuous, high-performance support for mission-critical applications and demanding environments.
  • 04

    Tailored Customization Services

    BIWIN offers a full range of hardware customization and packaging/testing services, leveraging proprietary firmware to deliver key features such as fast boot, ultra-low power consumption, and SoC optimization. Custom versions are provided based on each customer's specific requirements, delivering precise, high-quality solutions tailored to unique requirements.
  • Write Protection

  • Quick Erase

  • Wear Leveling

  • Garbage Collection

  • TRIM Command

  • Smart Wearable

    Smart Wearable

  • AR/VR

    AR/VR

Specifications

Latest Update: 2025/10/14
Product Line
Embedded
Product Grade
Consumer
Model Name
ePoP LPDDR4X
Interface
eMMC 5.1 + LPDDR4X
Capacity
32 GB + 16 Gb
64 GB + 16 Gb
64 GB + 32 Gb
Performance (eMMC 5.1)
Sequential Read: 290 MB/s
Sequential Write: 150 MB/s
Performance (LPDD4X)
Up to 4266 Mbps
Operating Voltage (eMMC 5.1)
VCC=3.3 V
VCCQ=1.8 V
Operating Voltage (LPDDR4X)
VDD1=1.8 V
VDD2=1.1 V
VDDQ=0.6 V
Dimensions
8.00 × 9.50 mm, 8.60 × 10.40 mm, 10.00 × 10.00 mm
Packaging
ePoP 144 Ball
Operating Temperature
-25°C to +85°C
Storage Temperature
-40°C to +85°C
Supported Platforms
Ingenic, Qualcomm, Unisoc
Warranty
3-Year Limited

Order Information

Capacity

32 GB + 16 Gb
32 GB + 16 Gb
64 GB + 16 Gb
64 GB + 32 Gb

Part Number

BWCK1EZH-32G-X
BWCL1EZC-32G-X
BWCK1EZC05-64G
BWCK1KZC02-64G

Packaging

FBGA144
FBGA144
FBGA144
FBGA144

Dimensions

8.00 × 9.50 mm
8.60 × 10.40 mm
8.00 × 9.50 mm
8.00 × 9.50 mm
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product life cycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. Please visit www.biwintechnology.com for warranty details in your region.
6. For more information, please contact sales@biwintech.com.

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