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AP665 SSD

High-Speed PCIe 3.0 M.2 2230 OEM SSD with 3D TLC NAND and Optimized Power Efficiency

PCIe Gen3x4, NVMe 1.4
Up to 3500 MB/s Read
Low Power Consumption
  • Capacity
    512 GB 1 TB
  • Flash Type
    3D TLC
  • Operating Temperature
    0°C to +70°C

Overview

BIWIN AP665 OEM SSD integrates high-performance controllers with advanced 3D TLC NAND flash technology, supporting PCIe 3.0 and NVMe 1.4 protocols. It delivers exceptional read speeds up to 3500 MB/s and write speeds up to 3100 MB/s for optimal performance for demanding applications. Designed with both hardware and firmware optimizations, the AP665 offers outstanding power efficiency alongside its high-speed capabilities. It is available in capacities of 512 GB and 1 TB and features a compact M.2 2230 form factor, providing flexible storage solutions for a wide range of devices.

  • 01

    Unleash High-Speed Data Transfers

    The BIWIN AP665 leverages a PCIe Gen3x4 interface and NVMe 1.4 protocol to provide read and write speeds up to 3500 MB/s and 3100 MB/s. With its advanced technology, the AP665 delivers reliable, fast data transfers, improving overall system efficiency and minimizing downtime across applications.
  • 02

    Intelligent Temperature Control

    The BIWIN AP665 employs a single-sided design combined with an intelligent temperature control algorithm, effectively managing heat dissipation. Engineered to prevent overheating, it delivers reliable stability under heavy workloads for consistent performance and a longer lifespan.
  • 03

    Low Power Consumption

    The BIWIN AP665 integrates an advanced intelligent power management unit with NVMe power management technology, offering precise control over power consumption in both active and idle modes. This ensures ultra-low power usage, enhancing battery life and supporting extended operation.
  • 04

    Multiple Cutting-Edge Technologies

    Built to meet the rigorous demands of high-performance environments, the BIWIN AP665 integrates cutting-edge features such as dynamic/static wear leveling, TRIM command, S.M.A.R.T., intelligent thermal throttling, garbage collection and more. Designed for optimal durability and efficiency, it offers continuous performance and comprehensive protection against data loss.
  • 05

    Quality Assurance with Rigorous Testing

    The BIWIN AP665 is built with premium flash memory chips and undergoes a rigorous testing process, including electrical, application, and compatibility tests, ensuring exceptional performance and reliability. With a 3-year warranty and technical support, the BIWIN AP665 provides long-term reliability and performance, offering complete peace of mind for customers.

  • Modern Standby

  • ATA Encryption

  • End-to-End Data Protection

  • S.M.A.R.T.

  • Garbage Collection

  • TRIM Command

  • Dynamic/Static Wear Leveling

  • In-drive RAID

  • Bad Block Management

  • Read Scrub

  • SLC Cache Acceleration

  • Intelligent Thermal Throttling

  • ESD Protection

  • Read Disturbance

  • Firmware Update

  • Desktop

  • Laptop

  • Tablet

  • All-in-One PC

  • Thin Client

  • Mini PC

Specifications

Latest Update: 2025/08/03
Product Line
SSD
Product Grade
Consumer
Model Name
AP665
Interface
PCIe Gen3x4, NVMe 1.4
Form Factor
M.2 2230
Flash Type
3D TLC
Firmware
SLC Cache
DRAM Cache
DRAM-less
Capacity
512 GB
1 TB
Sequential Read (Up to)
3500 MB/s
Sequential Write (Up to)
3100 MB/s
Random Read 4K (Up to)
500K IOPS
Random Write 4K (Up to)
350K IOPS
Read Power Consumption (Max.)
2.5 W
Write Power Consumption (Max.)
2.6 W
Idle Power Consumption (Max.)
50 mW
Dimensions
22.00±0.15 x 30.00±0.15 x 2.30 (Max.) mm
Operating Temperature
0°C to +70°C
Storage Temperature
-40°C to +85°C
Certifications
CE, FCC, RoHS, HF, REACH
MTBF
>1,500,000 hours
TBW
250 TBW
Warranty
3-Year Limited

Order Information

Capacity

512 GB
1 TB

Part Number

CE430TI8800-512
CE430TI8800-1TB
1. Tested by BIWIN labs. Actual performance may vary due to systems, devices, or environment.
2. Maintenance and future updates are required throughout the product lifecycle. Specifications are subject to change without notice.
3. The pictures are for illustration only. Actual products may vary due to product enhancements or changes.
4. Not all products are sold in all regions of the world.
5. As used for storage capacity, one megabyte (MB)= one million bytes, one gigabyte (GB) = one billion bytes, and one terabyte (TB) = one trillion bytes. Total accessible capacity varies depending on the operating environment. As used for buffer or cache, one megabyte (MB) = 1,048,576 bytes. As used for transfer rate or interface, megabyte per second (MB/s) = one million bytes per second, and gigabyte per second (GB/s) = one billion bytes per second.
6. MTBF = Mean Time Between Failures based on internal testing using the Telcordia stress testing standard.
7. Please visit www.biwintechnology.com for warranty details in your region.
8. For more information, please contact sales@biwintech.com.

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