Compact Yet Powerful: BIWIN Industrial BGA SSD, the All-Rounder for the AIoT Era

Meeting the emerging edge AI demand for high-performance, highly integrated, and miniaturized storage, BIWIN introduces its industrial BGA SSD. Measuring just 16.0 x 20.0 x 1.3 mm, it offers up to 1 TB of capacity and PCIe Gen4x4 high-speed data transfer. Its BGA packaging ensures durability even in devices exposed to frequent movement or vibrations, making it ideal for edge computing, AI smart boxes, industrial control, smart vehicles, industrial tablets, and more.

For AIoT Edge Intelligence Scenarios: Smaller, Stronger, Smarter

The BIWIN industrial BGA SSD is designed for the edge-intelligence era, delivering high computing power and low latency for edge AI applications. It also meets industrial standards for long lifecycle, multi-interface compatibility, and stable operation under extreme temperatures, humidity, and other challenging conditions. It offers a robust data storage foundation for various intelligent applications.

With sequential read/write speeds of up to 7300 MB/s and 4600 MB/s, and capacities ranging from 256 GB to 1 TB, the BGA SSD is a great solution for lightweight embedded devices and high-load edge computing nodes alike. Its environmental adaptability includes three wide-temperature grades: industrial standard (-20°C to 70°C), industrial wide (-40°C to 85°C), and ultra-wide (-40°C to 105°C), ensuring data integrity and reliability in industrial, outdoor, automotive, and high-temperature sealed environments.

Advanced Self-Developed Firmware Architecture for Scenario-Specific Optimization

Equipped with self-developed firmware, the BIWIN BGA SSD is optimized for scenario-specific applications, ensuring top performance in space-constrained setups and challenging thermal conditions.

Intelligent Read/Write Scheduling and GC Optimization: Reduces write amplification and redundant erasures, enhancing the BGA SSD’s performance and lifespan across all scenarios, meeting the long-term high-reliability demands of edge/endpoint devices operating outdoors or in unattended environments.
Fast Boot Algorithm and Low-Latency Access Mechanism: Supports instant boot for industrial tablets, autonomous vehicles, and smart cockpits; enables efficient scheduling and real-time processing in industrial automation lines, ensuring stable system responses and meeting the requirements of high-precision smart manufacturing environments.

Data Integrity: Integrated with a 4K LDPC error correction engine, end-to-end data protection, and RAM ECC, coupled with wide-temperature support and rigorous testing for data integrity and system stability in harsh industrial environments.

On-Demand Customization and Broad Compatibility: Offers specific encryption algorithms, secure boot support, and S.M.A.R.T. monitoring for high-security data environments; supports compatibility optimization with multiple operating systems, enhancing overall system performance.

Self-Packaging, Testing, and Manufacturing for Rigorous Quality Control and Stable Delivery

BIWIN has mastered BGA packaging design and process technology, ensuring that the products deliver excellent electrical performance, signal integrity, and thermal management. Through BIWIN’s comprehensive testing capabilities, including hardware development, testing algorithms, and automated testing platforms, BGA SSDs undergo stringent industrial reliability tests such as extended high-temperature aging, temperature cycling, and vibration tests for higher stability and better yield.

BIWIN operates with vertical integration from R&D, packaging testing, to manufacturing, establishing a robust quality control system while significantly enhancing production efficiency and delivery reliability. With deep integration and rapid response mechanisms in its supply chain, BIWIN ensures stable production output and fast delivery, while also offering flexible support for small-batch customization to meet specific application scenarios, driving efficient deployment and continuous innovation in edge computing and industrial systems.

“As devices continue to shrink, balancing performance improvements with power efficiency has become an increasingly complex challenge for storage integration and manufacturer expertise,” said Peng Peng, General Manager of BIWIN Industrial and Automotive. “At BIWIN, we are committed to industrial-grade storage innovation. Our capabilities span chip design, firmware algorithms, hardware development, advanced packaging technology, and in-house manufacturing. From product selection and packaging design to production and delivery, we maintain strict process controls and quality management, ensuring each chip meets the demanding requirements of edge computing and AIoT high-performance applications.”